Memorija Team T-Force Vulcan Z - DDR4 - 8 GB - DIMM 288-pin, TLZGD48G3200HC16C01


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Memorija Team T-Force Vulcan Z - DDR4 - 8 GB - DIMM 288-pin, TLZGD48G3200HC16C01
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Proizvođač: Team Group
Šifra: 1348933
Kataloški broj: TLZGD48G3200HC16C01
Jamstvo: 12
Raspoloživost: Dobavljivo (Dobavljivo)
isporuka 5-8 radnih dana
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*U navedeni rok se ne računaju subote i nedjelje, te državni praznici i ostali neradni dani. U slučaju slanja dostavnom službom nije uračunato vrijeme dostave.
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T-Force Vulcan Z's cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity - thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering a smooth gaming experience and an extreme performance without any lag.

Osnovne karakteristike
Utor: DDR4
Kapacitet: 8 GB
Pakiranje: Modul
Radni takt [MHz]: 3.200
Latencija: CL16
Ostale karakteristike
Profil: Info Nema
RGB: Info Ne
Hladnjak: Crni


*Unatoč uloženom trudu da damo što bolji i točniji opis, slike i specifikacije, ne možemo garantirati da su svi navedeni podaci točni te ne odgovaramo za eventualne pogreške nastale u opisu proizvoda, slika ili specifikacija. Iste je potrebno provjeriti na stranicama proizvođača ili pošaljite upit našim djelatnicima da provjere.
Ukoliko na našoj stranici otkrijete neistinite odnosno neadekvatne informacije, molimo vas da nam to javite na prodaja[o]protis.hr

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Memorija Team T-Force Vulcan Z - DDR4 - 8 GB - DIMM 288-pin, TLZGD48G3200HC16C01 Memorija Team T-Force Vulcan Z - DDR4 - 8 GB - DIMM 288-pin, TLZGD48G3200HC16C01 T-Force Vulcan Z's cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity - thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering a smooth gaming experience and an extreme performance without any lag.<table style="border:none;width:60%"></table>
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Team Group
Team Group
16.50 EUR